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Buy High Strength Perfect Bond Silver Epoxy Adhesive Glue For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 100gm kit in United States - Rehmie.com

High Strength Perfect Bond Silver Epoxy Adhesive Glue For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 100gm kit

REP1070947 REP1070947

Atom Adhesives

Atom Adhesives
2025-04-18 USD 641.1

$ 641.10 $ 654.18

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*Product availability is subject to suppliers inventory

High Strength Perfect Bond Silver Epoxy Adhesive Glue  For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 100gm kit
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High Strength Perfect Bond Silver Epoxy Adhesive Glue  For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 100gm kit
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High Strength Perfect Bond Silver Epoxy Adhesive Glue  For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 100gm kit
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High Strength Perfect Bond Silver Epoxy Adhesive Glue  For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 100gm kit
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High Strength Perfect Bond Silver Epoxy Adhesive Glue  For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 100gm kit
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High Strength Perfect Bond Silver Epoxy Adhesive Glue  For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 100gm kit
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Brand Atom Adhesives
Model AA-DUCT 902-100
Type Adhesives
Color/Finish Silver
Application Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
Features High strength, Perfect bond, Cold solder for heat-sensitive components
+ PRODUCT DESCRIPTION: AA-DUCT 902 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm•cm. AA-DUCT 902 is also characterized by a wide operating temperature range from –50 to +170°C. AA-DUCT 902 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties. + PRODUCT PROPERTIES: - Appearance: Silver - Cure Type: Heat cure or Room temperature - Benefits: * High strength * Perfect bond * Cold solder for heat-sensitive components - Mix Ratio by weight 100:5 / Resin:Hardener - Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. - Operating Temperature: –50 to +170°C - Typical Applications: Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair + UNCURED PROPERTIES: - Specific Gravity, mixed: 2.79 - Reactive solids contents, %: 100 - Pot Life: 1Hour - Shelf Life: 1 Year - Viscosity: Paste + CURE SCHEDULE: 15 minutes @ 100°C 45 minutes @ 50°C 24 hours @ Room temperature + CURED PROPERTIES: - Hardness, Shore D: 85 - Shrinkage linear in/in: 0.0003 - Lap shear strength, psi: 9400 - Volume Resistivity ohm. cm :< 0.0001 - Thermal Expansion Coefficient, (cm / cm / °C • 10-5): 1.5 - Thermal Conductivity, btu / hr / ft2 / °F / in: 100 - Tensile Strength, psi: 9500 - Compressive Strength, psi: 14,000 - Heat Distortion, °C: 95 - Electrical Resistivity : < 1x10 -4 ohm•cm + GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). + AVAILABILITY: This epoxy can be supplied in various different packages. CALL (888) 522-6742 for more informations.

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